Some investors asked Aisen Co., Ltd. According to a blog post published by Jibang Consulting on May 19, based on information revealed by German equipment company SCHMID, TSMC is promoting panel-level CoPos packaging, with a key specification of 310 x 310 mm, and evaluating the integration of glass materials at the same size.

Some investors asked Aisen Co., Ltd. According to a blog post published by Jibang Consulting on May 19, based on information revealed by German equipment company SCHMID, TSMC is promoting panel-level CoPos packaging, with a key specification of 310 x 310 mm, and evaluating the integration of glass materials at the same size.