Shindengen provides power semiconductor packaging know-how to India’s CDIL OSAT line

• Shindengen will be recognized by India on Sep. 17, 2026 for technical cooperation with CDIL on power semiconductor packaging.
• Collaboration supports a new CDIL packaging line under India’s subsidy program, strengthening local OSAT capabilities.
• Move aligns with Shindengen’s India expansion strategy, including plans to explore local power semiconductor production using OSAT partners.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Shindengen Electric Manufacturing Co. Ltd. published the original content used to generate this news brief on September 17, 2026, and is solely responsible for the information contained therein.