Entering the end of the third quarter, TSMC's 3nm and 2nm advanced manufacturing processes and COWOS advanced packaging production capacity continued to be in short supply. Supply chain sources revealed that Nvidia, Apple, etc. continue to occupy TSMC's advanced process and packaging resources. In addition, Amazon AWS recently expanded the launch of self-developed AI chips, and its subsidiary Annapurna has obtained more 3nm production capacity. In addition to mobile phone chips, MediaTek is also competing for 2/3nm process and Cowos-S/L production capacity due to Google's TPU related big orders.

Entering the end of the third quarter, TSMC's 3nm and 2nm advanced manufacturing processes and COWOS advanced packaging production capacity continued to be in short supply. Supply chain sources revealed that Nvidia, Apple, etc. continue to occupy TSMC's advanced process and packaging resources. In addition, Amazon AWS recently expanded the launch of self-developed AI chips, and its subsidiary Annapurna has obtained more 3nm production capacity. In addition to mobile phone chips, MediaTek is also competing for 2/3nm process and Cowos-S/L production capacity due to Google's TPU related big orders.