The Ministry of Industry and Information Technology and the National Development and Reform Commission recently jointly issued the “Fifteenth Five-Year Plan for the Development of the Electronic Information Manufacturing Industry”. The plan is proposed to promote research on the entire integrated circuit chain. Develop high-end chip products such as high-performance processors, high-density memories, and high-reliability analog and digital-analog hybrid chips. Improve the level of integrated circuit manufacturing, make refined and mature processes, and improve advanced process capabilities. Promote the development and application of advanced packaging testing technology. Promote the upgrading of the wide bandgap semiconductor industry, and promote the industrialization and development of ultra-wide bandgap semiconductors such as gallium oxide and diamond. Continue to improve the supply capacity of key equipment, materials and components, accelerate the development of electronic design automation tools and intellectual property rights, and promote technological breakthroughs and applications such as 3D integration.

The Ministry of Industry and Information Technology and the National Development and Reform Commission recently jointly issued the “Fifteenth Five-Year Plan for the Development of the Electronic Information Manufacturing Industry”. The plan is proposed to promote research on the entire integrated circuit chain. Develop high-end chip products such as high-performance processors, high-density memories, and high-reliability analog and digital-analog hybrid chips. Improve the level of integrated circuit manufacturing, make refined and mature processes, and improve advanced process capabilities. Promote the development and application of advanced packaging testing technology. Promote the upgrading of the wide bandgap semiconductor industry, and promote the industrialization and development of ultra-wide bandgap semiconductors such as gallium oxide and diamond. Continue to improve the supply capacity of key equipment, materials and components, accelerate the development of electronic design automation tools and intellectual property rights, and promote technological breakthroughs and applications such as 3D integration.