Kioxia, SanDisk unveil joint 10th-gen QLC 3D NAND technology at FMS

• SanDisk, working with Kioxia, unveiled 10th-generation QLC 3D flash memory targeting AI and cloud storage architectures.
• Technology uses CBA wafer bonding; bit density rises up to 60% versus the 8th generation to more than 37 Gb/mm².
• Interface speed reaches 4.8 Gb/s using Toggle DDR6.0; design changes aim to lift bandwidth and cut I/O power use.

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