Samsung, Broadcom sign MOU to expand memory and foundry collaboration for AI chips

• Samsung Electronics signed an MOU with Broadcom to expand collaboration across memory and foundry for next-generation AI infrastructure.
• Companies projected more than $200 billion of combined memory and foundry collaboration over the next five years through 2030.
• Deal scope includes HBM supply for Broadcom AI accelerators, Samsung 2-nm and below foundry work, supported by advanced packaging.

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