Lens Technology signs Intel memorandum to explore through-glass via packaging collaboration

• Lens Technology’s Hong Kong unit signed a one-year memorandum of understanding with Intel to explore cooperation in through-glass via advanced packaging.
• Talks center on process development for glass-substrate vias, with Intel providing manufacturing guidance and validation methods under separate agreements.
• Any qualification work or volume production would require definitive contracts; the memorandum is largely non-binding aside from IP and confidentiality terms.
• Lens has built pilot lines, started sample trial production, delivered samples to potential customers, and said the business has not yet affected results.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Lens Technology Co. Ltd. published the original content used to generate this news brief via IIS, the regulatory disclosure system operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260724-12256138), on July 24, 2026, and is solely responsible for the information contained therein.